In semiconductor packaging, shrinkage simulations often emphasize the thermal effects of materials. However, real-world data frequently show discrepancies—not only in the magnitude of deformation but also in the patterns of warpage. Research has identified that cure-induced shrinkage of epoxy is a critical factor, with effects on par with those caused by temperature changes.

The PVTC Analyzer offers precise measurement of specific volume or volume change under varying temperatures and pressures, enabling a deeper understanding of how volume correlates with the degree of cure.

For more information, please contact Mercury Mercantile.